| Construction | Shape & Dimensions | Subject to attached chart regulation |
| Poles | Number of Positions | 2~16 |
| Applicable Wires | Wire Gauge | AWG#32~#28 |
| Ambient Temperature Range | Operating Temperature | -40~+85 |
| Applicable PC Board Thickness | Board Thickness | 0.6~1.2mm |
| Voltage Rating | Rated Voltage | 200V AC/DC |
| Current Rating | Rated Current | 1.0A Max |
| Environmental Protection | Compliance | RoHS compliant and customers environment protection request compliant |
| Packaging | Standard Packing | Taping specifications, sealed in carton, no shaking |
| Transportation Temperature | Range | -20~+50 |
| Storage Conditions | Temperature | -20~+50 |
| Storage Conditions | Relative Humidity | <80% |
| Storage Conditions | Environment | No corrosive gases |
| Appearance | Visual Inspection | Plastic parts: smooth, flat, no defects. Metal parts: bright, even, no rust/oxide/damage. |
| Contact Resistance | Test Condition | Mate connectors, measure by dry circuit |
| Contact Resistance | Requirement | <=0.03 |
| Insulation Resistance | Test Condition | Mate connectors, apply 250V DC between adjacent terminals or ground |
| Insulation Resistance | Requirement | >=1000M |
| Withstand Voltage | Test Condition | Apply 1000V AC for 1min between adjacent terminals or ground |
| Withstand Voltage | Requirement | No Breakdown or flashover |
| Insertion Force | Test Condition | Insertion speed 1mm/s~5mm/s |
| Insertion Force | Requirement | <6.0N * number of contacts |
| Withdrawal Force | Test Condition | Withdrawal speed 1mm/s~5mm/s |
| Withdrawal Force | Requirement | >1.0N * number of contacts |
| Terminal/Housing Retention Force | Test Condition | Axial pull out force at speed <=25mm/min |
| Terminal/Housing Retention Force | Requirement | >=5N |
| Crimping Pull Out Force | Test Condition | Axial pull out force on wire at speed <=25mm/min |
| Crimping Pull Out Force | Requirement | 28#: 10N (Min), 30#: 8N (Min), 32#: 6N (Min) |
| Pin Retentive Force | Test Condition | Push pins out vertically at speed 255mm/min |
| Pin Retentive Force | Requirement | >=3N |
| Heat Resistance | Test Condition | 852 for 4h |
| Heat Resistance | Contact Resistance | <=0.02 |
| Heat Resistance | Appearance | No damage |
| Cold Resistance | Test Condition | -402 for 4h |
| Cold Resistance | Contact Resistance | <=0.02 |
| Cold Resistance | Appearance | No damage |
| Temperature Cycling | Test Condition | 5 cycles of (-402) for 2h, then (852) for 2h, with 1h at room temp between cycles |
| Temperature Cycling | Contact Resistance | <=0.02 |
| Temperature Rise | Test Condition | Carrying rated current load |
| Temperature Rise | Requirement | <=30 |
| Humidity | Test Condition | 402, 90~95% RH for 96h |
| Humidity | Insulation Resistance | >=100M |
| Humidity | Contact Resistance | <=0.02 |
| Humidity | Appearance | No damage |
| Vibration Resistance | Test Condition | 10~55Hz (0.35mm amplitude), 55~500Hz (50m/s2 acceleration) for 2h in each axis |
| Vibration Resistance | Discontinuity | <=1S |
| Mechanical Life | Test Condition | 50 cycles repeatedly at 10 cycles/min |
| Mechanical Life | Contact Resistance | <=0.02 |
| Salt Spray Test | Test Condition | 24h exposure to 51% NaCl solution |
| Salt Spray Test | Appearance | No damage, no corrosion (for metal parts) |
| Solderability | Test Condition | Immerse in 2355 tin bath for 20.5 sec |
| Solderability | Wetting Area | >=95% |
| Resistance to Soldering Heat | Test Condition | Immerse in 2605 tin bath for 51 sec |
| Resistance to Soldering Heat | Appearance | No damage, no deformation |
