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3M 150232-2020-RB Boardmount Socket Compatible with Maximum 260 Degree Celsius Reflow Solder Process

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3M 150232-2020-RB Boardmount Socket Compatible with Maximum 260 Degree Celsius Reflow Solder Process

Pitch : 2mm

Row Spacing : 2mm

Number of Rows : 双排

Number of Pins : 32P

Voltage Rating (Max) : 500V

Contact Plating : 锡

Operating Temperature : -55℃~+105℃

Current Rating : 1A

Mounting Type : 立贴

Description : Female Header 32 Position 2mm Pitch Dual Row Surface Mount -55℃~+105℃

Mfr. Part # : 150232-2020-RB

Package : SMD,P=2mm

Model Number : 150232-2020-RB

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Product Overview

The 3M Boardmount Socket 1502 Series offers a 2 mm x 2 mm pitch for straight surface mount, straight, and right-angle plated through-hole applications. These sockets feature high-temperature insulators, reflow solder compatibility, and a low profile to minimize PCB stack height. They are end stackable, with through-hole versions also being side stackable. Surface mount parts are available in tape and reel packaging with a vacuum cap for automated placement. Designed for reliability, they offer a current rating of 1 A and excellent insulation resistance.

Product Attributes

Brand: 3M
Product Line: 1502 Series
Contact Spacing: 2 mm x 2 mm
Mounting Type: Straight Surface Mount, Straight Plated Through-Hole, Right Angle Plated Through-Hole
Insulator Material: Glass Filled LCP (Surface Mount), Glass filled PCT (Vertical Thru-Hole, Right Angle Thru-Hole)
Contact Material: Copper alloy
Plating (Underplating): Nickel
Plating (Wiping Area): Gold
Plating (Solder Tails): Matte tin or tin-lead
Temperature Rating: -55C to +105C
Process Rating: Maximum 260C (per J-STD-020C)
Moisture Sensitivity Level: 1 (per J-STD-020C)
Certifications: UL File No. E68080
RoHS Compliance: RIA E1 & C1 apply (refer to Regulatory Information Appendix)

Technical Specifications

Specification	Value
Contact Quantity (Example from Table 1)	04 to 60
Dimension A (Contact Quantity)	3.96 mm [0.156 in] to 59.87 mm [2.357 in]
Current Rating	1 A
Insulation Resistance	> 1 10⁹ at 250 VDC
Withstanding Voltage	500 VDC at Sea Level
Temperature Rating	-55C to +105C
Process Rating	Maximum 260C (per J-STD-020C)
Moisture Sensitivity Level	1 (per J-STD-020C)
Nickel Underplating	1.27-3.81 m [50-150 ]
Gold Wiping Area Plating	0.76 m [30 ]
Matte Tin Solder Tails Plating	5.1 m [200 ]
Tin-Lead Solder Tails Plating	5.1 m [200 ]
Board Location Post Option	0 = None (Standard), 2 = With board location post (Special order)
Plating Suffix RB	0.76 m [30 ] Gold with matte tin solder tails (RIA E1 & C1 apply)
Plating Suffix TB	0.76 m [30 ] Gold with tin-lead solder tails (RIA E3 & C2 apply)
Packaging Style WX	Tape & reel pkg
Solder Tail Length Dimension B (Example)	1 = 1.4 mm (Special order), 2 = 2.54 mm (Standard)
Standoff Height Code 0 (Dimension B)	0.38 mm [0.015 in]
Standoff Height Code 1 (Dimension B)	1.35 mm [0.053 in]
Standoff Height Code 2 (Dimension B)	0.71 mm [0.028 in] (Available for 40, 44, and 50 positions only)

2410311323_3M-150232-2020-RB_C6041996.pdf

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