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XUNPU SMN-302-ACP7

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XUNPU SMN-302-ACP7

Model Number : SMN-302-ACP7

Operating Temperature : -40℃~+85℃

Brand Name : SMN-302-ACP7

MOQ : 1600

Description : Card Connector NANO SIM Push-Push Surface Mount

Height Above Board : 1.24mm

Packaging Details : SMD

Card Type : Nano-SIM Card

Connector Type : Connector and Ejector

Stock : 5000

Card Connection Mode : Push-Push

Delivery Time : 12-17工作日

Card Detection : With Card Detect

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Product Overview

This product is a 1.24 NANO SIM PUSH connector designed for various electronic applications. It features a durable construction with specific plating requirements for reliable connectivity. The connector is suitable for applications requiring a high number of cycles and operates within a defined temperature range.

Key Features:

Durable construction with Nickel and Gold plating on contacts.
High durability rating of 3000 cycles minimum.
Wide operating temperature range (-30C to +85C).
Recommended for IR-reflow soldering processes.
UL94V-0 rated thermoplastic housing.

Product Attributes

Brand

XunPu Electronics

Origin

DongGuan

Certifications

ROHS Compliant

Material - Housing

LCP UL94V-0

Material - Contact

Copper Alloy

Material - Shell

Stainless Steel

Material - Slide

Stainless Steel

Material - Spring

Thermoplastic

Material - Detect Pin

Copper Alloy

No.	Description	QTY	Material	Remarks
1	HOUSING	1	LCP UL94V-0
2	SHELL	1	STAINLESS STEEL	30u"MIN GOLD PLATING ON SOLDERING AREA.
3	CONTACT	1	COPPER ALLOY	8
4	DETECT PIN	1	COPPER ALLOY
5	SLIDE	1	STAINLESS STEEL
6	SPRING	1	STAINLESS STEEL
7	LINK	1	STAINLESS STEEL

Item	Specification	Requirement
FINISH	CONTACT: 8 "MIN NICKEL UNDER PLATED, 1u"MIN GOLD PLATING ON CONTACT AREA, GOLD FLASH PLATING ON SOLDERING AREA
SHELL	30u"NICKEL UNDER PLATED; 1u"MIN GOLD PLATING ON SOLDERING AREA.
RATED CURRENT	0.5A
CONTACT RESISTANCE	50m MAX
INSULATION RESISTANCE	1000M MIN 200V DC FOR 1 MINUTE
DIELECTRIC WITHSTANDING VOLTAGE	500V AC FOR 1 MINUTE.
DURABILITY	3000 CYCLES MIN
OPERATING TEMP	-30C~+85C
STORAGE TEMP	-40C~+85C
RECOMMENDED PROCESS CONDITION	IRREFLOW PEAK TEMPERATURE AND TIME: 250C, 5-10S
METALMASK THICKNESS	0.10MM MIN

Nave	Description	QTY
c1	RST OF SIM	1
c2	CLK OF SIM	1
c3	GND OF SIM	1
c4	VPP OF SIM	1
c5	I/O OF SIM	1
c6	SW	1
c7	PAD AREA	1

Pin Assignment	Description	QTY
1	VCC OF SIM	1
2	RST OF SIM	1
3	CLK OF SIM	1
4	GND OF SIM	1
5	VPP OF SIM	1
6	I/O OF SIM	1
7	SW	1

XUNPU SMN-302-ACP7 Images

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