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Phoenix Contact 1714929

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Phoenix Contact 1714929

Name: Phoenix Contact 1714929
Brand: 1714929
Price: 1 USD

Quality Phoenix Contact 1714929 for sale

Delivery Time : 16-30 weeks

Mounting Type : Surface Mount,Vertical

Row Spacing : 1.27mm

Packaging Details : SMD

Stock : 28000

Contact Material : Copper alloy

Description : Copper alloy 2 -55℃~+125℃ 1.27mm Surface Mount,Vertical SMD Headers, Male Pins RoHS

MOQ : 280

Brand Name : 1714929

Operating Temperature : -55℃~+125℃

Model Number : 1714929

Number of Rows : 2

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Product Overview

This SMD male connector, part of the FR 1,27/..-MV 3,25 product family, offers a compact and high-position solution for board-to-board or wire-to-board connections. Designed for space-saving device implementations, it facilitates stacked, coplanar, or orthogonal PCB connections for maximum design flexibility. The gold-plated contacts ensure stable long-term transfer quality. This connector can be combined with female connectors of different heights to achieve individual PCB spacings ranging from 8 mm to 13.8 mm.

Product Attributes

Brand: Phoenix Contact
Product Type: SMD male connector
Product Family: FR 1,27/..-MV 3,25
Color (Housing): Black (9005)
Contact Surface: Gold (Au)
Contact Material: Cu alloy
Housing Material: LCP
Country of Origin: CN
Certifications: cULus Recognized (Approval ID: E118976-20170331)
Environmental Compliance: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201, Environmentally friendly use period: unlimited = EFUP-e, China RoHS: No hazardous substances above threshold values

Technical Specifications

Specification	Value
Item Number	1714929
Number of Positions	32
Pitch	1.27 mm
Number of Rows	2
Number of Potentials	32
Pin Layout	Linear pad geometry
Nominal Current (IN)	1.4 A (at 20C 50-pos.)
Test Voltage	500 V AC
Contact Resistance	25 m
Insulation Resistance (neighboring positions)	10 G
Rated Insulation Voltage (III/3)	500 V
Rated Insulation Voltage (II/2)	10 V
Rated Surge Voltage (II/2)	0.8 kV
Mounting Type	SMD soldering
Process	Reflow soldering
Moisture Sensitive Level (MSL)	1
Classification Temperature (Tc)	260 C
Contact Surface (top layer)	Gold (Au)
Contact Surface (middle layer)	Nickel (Ni)
Contact Surface (alloys)	Palladium nickel, (PdNi)
Soldering Area (top layer)	Tin (Sn)
Comparative Tracking Index (CTI)	175
Flammability rating (UL 94)	V0
Width [w]	25.41 mm
Height [h]	8.95 mm
Length [l]	7.2 mm
Installed height	8.25 mm
Contact cover	0.9 mm
Center offset (longitudinal and transverse)	0.7 mm
Stack height	12.3 mm (Tolerance: +1,5 mm with FP 1,27/...-FV 9,05)
Wipe length	1.5 mm
Angular tolerance (longitudinal)	4
Angular tolerance (transverse)	2
PCB design Pad geometry	0.8 x 1.1 mm
Insertion strength per pos.	approx. 0.5 N
Withdraw strength per pos.	approx. 0.5 N
No. of cycles (Durability)	500
Vibration test Frequency	10 - 2000 - 10 Hz
Vibration test Amplitude	1.5 mm (10 Hz ... 60.1 Hz), 20g (60.1 Hz ... 2000 Hz)
Shocks Acceleration	50g
Shock duration	11 ms
Ambient temperature (operation)	-55 C ... 125 C
Ambient temperature (storage/transport)	-40 C ... 70 C
Relative humidity (storage/transport)	30 % ... 70 %
Ambient temperature (assembly)	-5 C ... 100 C
Type of packaging	44 mm wide tape [W]
Tape width [W2]	44 mm
Coil overall dimension [A]	50.4 mm
Coil diameter	330 mm
Outer packaging type	Transparent-Bag
ESD level (D)	electrostatically conductive

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