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Delivery Time : 5-7工作日
Stock : 20000
Mounting Type : Surface Mount, Right Angle
Contact Material : Copper alloy
Pitch : 1mm
Contact Plating : Gold
Description : FFC/FPC Connector 30 Position 1mm Pitch Surface Mount, Right Angle
Packaging Details : SMD,P=1mm,Surface Mount,Right Angle
Brand Name : HYCW55-LVDS30-230B
MOQ : 1000
Number of Contacts : 30P
Model Number : HYCW55-LVDS30-230B
This document outlines the technical specifications and recommended PCB layout for a component. Key features include material composition for housing, terminals, and shell, with specific plating and thickness requirements. It also addresses product warpage and component mounting restrictions in specific areas.
LCP BLACK UL94V-0
COPPER ALLOY /Au 3u MIN ON CONTACT AREA AND SELECTIVE Au 1u MIN SOLDERING AREA OVER Ni 50u MIN
COPPER ALLOY /Au OVER Ni 50u MIN
X 0.30, X 0.38, XXXX 0.15
| Dimension | Value (mm) | Tolerance (mm) |
|---|---|---|
| 6.70 | 0.10 | |
| 19.47 | 0.15 | |
| 21.25 | 0.15 | |
| 16.30 | 0.05 | |
| 14.50 | 0.03 | |
| 0.55 | 0.10 | |
| 15.60 | 0.10 | |
| 18.30 | 0.05 | |
| 23.20 | 0.10 | |
| 0.55 | 0.15 |
| Specification | Value |
|---|---|
| Maximum Warpage | 0.10mm |
| Note on Plug with Pull-Bar | Cannot mount another component in this area. |
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HOAUC HYCW55-LVDS30-230B Images |
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