3M 8432-21B1-RK-TP

3M Chip Carrier Sockets Surfacemount 8400 Series

These surfacemount chip carrier sockets are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular. They feature high temperature insulation compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open top design allows for unrestricted airflow, and molded slots facilitate easy device extraction. Optional PCB locating posts are available. The product is RoHS Compliant.

Important Notice Regarding Tin Whiskers

The 3M PLCC products are tin plated on the contact wiping surface to ensure mated reliability, as standard PLCC contacts are also tin plated. Tin whiskers are an inherent characteristic of tin, and mechanical stressing can stimulate their growth. It is possible for the PLCC and PLCC socket to exhibit tin whisker growth after mating. 3M follows iNEMI plating recommendations, which include whisker-mitigating tin plating chemistry to reduce the likelihood of growth. Please consider whether a PLCC socket is suitable for your particular needs after evaluating your product application's lifespan and environment, including mechanical stresses, humidity, and thermal cycling, all of which can stimulate tin whisker growth.