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3M 8420-11B1-RK-TP

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3M 8420-11B1-RK-TP

MOQ : 1872

Packaging Details : Through Hole

Brand Name : 8420-11B1-RK-TP

Description : Through Hole IC Sockets RoHS

Model Number : 8420-11B1-RK-TP

Stock : 1872000

Delivery Time : 33-37周

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Product Overview

The 3M Chip Carrier Sockets, 8400 Series, are low-profile, four-row, through-hole sockets designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. They are suitable for wave soldering but not for reflow soldering. These sockets are RoHS Compliant.

Product Attributes

Brand: 3M
Product Line: 3M Chip Carrier Sockets
Series: 8400 Series
Type: Low Profile, Four-Row, Through Hole
Insulation Material: Glass Filled Polyester (PBT)
Flammability: UL 94V-0
Color: Black
Contact Material: Copper Alloy
Underplating: 50 " [ 1.27 m ] Nickel
Wiping Area Plating: 160 ", [ 4.06 m ] Matte Tin
RoHS Compliance: Yes (RIA E1 and C1 apply)
Packaging: Tubes

Technical Specifications

Specification	Value
Accepts Chip Carriers	JEDEC outline MO-047 (square) and MO-052 (rectangular)
Contact Resistance	15 m
Insulation Resistance	>10³ M minimum
Capacitance	<1 pF at 1 MHz
Temperature Rating	-40C to +105C
Process Rating	Wave Solder Only

Ordering Information

Contact Quantity	Part Number	A (mm [inch])	B (mm [inch])	C (mm [inch])	D (mm [inch])
20	8420-11B1-RK-TP	15.50 [0.611]	15.50 [0.611]	5.08 [0.200]	5.08 [0.200]
28	8428-11B1-RK-TP	18.05 [0.711]	18.05 [0.711]	7.62 [0.300]	7.62 [0.300]
32	8432-11B1-RK-TP	18.05 [0.711]	20.60 [0.812]	7.62 [0.300]	10.16 [0.400]
44	8444-11B1-RK-TP	23.50 [0.926]	23.50 [0.926]	12.70 [0.500]	12.70 [0.500]
52	8452-11B1-RK-TP	25.88 [1.020]	25.88 [1.020]	15.24 [0.600]	15.24 [0.600]
68	8468-11B1-RK-TP	31.05 [1.223]	31.05 [1.223]	20.32 [0.801]	20.32 [0.801]
84	8484-11B1-RK-TP	36.05 [1.420]	36.05 [1.420]	25.40 [1.001]	25.40 [1.001]

Notice: 3M PLCC products have tin plating on the contact wiping surface. Tin whiskers are an inherent characteristic of tin, and mechanical stressing can drive whisker growth. It is possible for PLCC and PLCC sockets to exhibit tin whisker growth after mating. 3M utilizes iNEMI plating recommendations with whisker-mitigating tin plating chemistry to reduce the likelihood of tin whisker growth. Users should consider the suitability of a PLCC socket based on their specific product application's lifespan, environment, mechanical stresses, humidity, and thermal cycling.

3M 8420-11B1-RK-TP Images

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