| Shock EZER | Detect electrical discontinuity more than 1ms while applying 10mA. | Acceleration: 490m/s, Wave form: Half sine curve, Drops: 3 times per each axis (total 18 times) | MIL-STD-202, METHOD 213, CONDITION A |
| Oil Resistance | Immerse mated connector in engine oil (SAE10W or equivalent) and kerosene (JIS K2203) mixture at 502C for 20 hours. | Oil mixture ratio: 1:1, Temperature: 502C, Duration: 20 hours | |
| Dust Resistance | Place mated connectors in an airtight tank (approx. 1000mm per side), spray 1.5kg of Portland cement for 10 seconds every 15 minutes, diffuse evenly. Cycle 8 times. Insert/withdraw connectors every 2 cycles. | Cement quantity: 1.5kg, Spray interval: 15 minutes, Cycles: 8 | |
| Sulfur Dioxide Resistance | Leave mated connectors in a tank filled with 10ppm sulfur dioxide at 402C and 90-95%RH for 24 hours. | Concentration: 10ppm SO, Temperature: 402C, Humidity: 90-95%RH, Duration: 24 hours | |
| Resistance To Solder Heat | Dip soldering: 2605C, 10s. Hand soldering: 35010C, 3s. | Dip soldering depth: 1.5mm from housing | |
| Solderability-wetting | Dip soldering area of cap assembly post to flux (rosin methanol) for 5-10 seconds, then dip to solder pool (tin: 60%, lead: 40%) at 2305C for 30.5 seconds. Observe under magnification. | Flux type: Rosin methanol, Solder composition: 60% Tin/40% Lead, Solder temperature: 2305C, Solder duration: 30.5 seconds | |
| Thermal shock | No physical damage. Satisfy low-level contact resistance (4.2.4) after test. | | |
| Moisture resistance | Satisfy leak current (4.2.6) during test. After test, satisfy insulation resistance (4.2.1), dielectric withstanding voltage (4.2.2), low-level contact resistance (4.2.4), contact retention (4.1.8), connector retention (4.1.9). | | |
| Salt spray | No corrosion harmful for connection. Satisfy low-level contact resistance (4.2.4) and contact resistance of crimped area (4.2.7). | | |
| Insertion & withdrawal endurance | No physical damage. Satisfy contact resistance (4.2.3), contact insertion/withdrawal force (4.1.3), connector insertion/withdrawal force (4.1.6) after test. | | |
| Pinching endurance | Satisfy contact resistance (4.2.3), contact insertion/withdrawal force (4.1.3), connector insertion/withdrawal force (4.1.6) after test. | | |
| Vibration | No mechanical damage and no electrical discontinuity more than 1ms during test. Satisfy contact resistance (4.2.3) after test. | | |
| Shock | No mechanical damage and no electrical discontinuity more than 1ms during test. Satisfy contact resistance (4.2.3), insulation resistance (4.2.1), dielectric withstanding voltage (4.2.2) after test. | | |
| Qil resistance | Satisfy contact resistance (4.2.3) after test. | | |
| Dust resistance | Satisfy contact resistance (4.2.3) after test. | | |
| Sulfur-dioxide resistance | Satisfy low-level contact resistance (4.2.4) after test. | | |
| Contact insertion & withdrawal force | Insertion force: 4.9 N max. Withdrawal force: 0.29-4.9 N | | 5.4.1 |
| Housing insertion force | 29.4N max. | | 5.4.2 |
| Lock strength | No released or breakage of lock, applied 49N. | | 5.4.3 |
| Connector Insertion/withdrawal force | Insertion force: 4.9N x n + 14.7N max. Withdrawal force: 0.20N x n ~ 49N x n + 14.7N (n = number of contacts) | | 5.4.4 |
| Contact insertion force into housing | 9.8N max. | | 5.4.5 |
| Contact retention | 14.7N min. for Pin header, 49N min. for Crimped contact | | 5.4.6 |
| Connector holding force | 58.8N min. | | 5.4.7 |
| Housing reverse insertion | Not reversely insertable. | | 5.4.8 |
| Contact reverse insertion | Not reversely insertable. | | 5.4.9 |
| Lock releasing force | 49N max. | | 5.4.10 |
| Crimped strength | Nominal section area mm: 0.85, 0.5, 0.3, 0.22. Equivalent AWG No.: 18, 20, 22, 24. Specified [N]: 127.4, 88.2, 49, 35.5 | | 5.4.11 |
| Insulation resistance | 100M min. at initial, 50M min. after test | | 5.4.12 |
| Dielectric withstanding voltage | No deformation or deposition damage in a housing and contacts. | | 5.4.13 |
| Contact resistance | 10m max. at initial, 20m max. after test | | 5.4.14 |
| Low-level contact resistance | 10m max. at initial, 20m max. after test | | 5.4.15 |
| Temperature rise | Temperature rise 50C max. at crimped area. | | 5.4.16 |
| Leak current | 1mA max. | | 5.4.17 |
| Contact resistance of crimped area | 2m max. at initial, 3m max. after test | | 5.4.18 |
| High-temperature exposure | Satisfy low-level contact resistance (4.2.4) and contact retention (4.1.8) after test. | | 5.4.19 |
| Low-temperature exposure | Satisfy low-level contact resistance (4.2.4) after test. No crack or deformation in the housing after drop test. | | 5.4.20 |
