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SHETIME TFW11-S1F1-2000-A

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SHETIME TFW11-S1F1-2000-A

Model Number : TFW11-S1F1-2000-A

Card Detection : Yes

Height Above Board : 2mm

Packaging Details : SMD

Delivery Time : 3-5工作日

Card Type : MicroSD Card (TF Card)

Brand Name : TFW11-S1F1-2000-A

Supplementary Features : With Locating Pins

Stock : 100000

Card Connection Mode : Push-Push

Description : Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS

MOQ : 1000

Connector Type : Connector and Ejector

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Product Overview

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. The T-FLASH connector is a type of external welding T-Flash connector.

Key Features:

Designed for T-Flash external welding applications.
Conforms to various international test standards (MIL-STD, EIA, JIS, IEC, UL, EN).
Materials comply with RoHS directive.
Suitable for SMT and Infrared Reflow soldering processes.
Resistant to cleaning processes.

Brand

(Twshetime)

Origin

Taiwan Factory: , China Factory:

Customer

Customer P/N

TFW1X-XXXX-X000-A

Product Name

T-Flash type CONN.

Part Number Example

TFW11-N1S1-2000-A

Housing Material

LCP UL94-V0

Contact Material

Copper Alloy

Shell Material

SUS201

Electroplating Specifications

Nickel Underlayer: 40u" MIN, Contact Area Gold: 0.5u" MIN, Solder Leg Area Matte Tin: 80u" MIN.

Plating Details

Contact: Gold Flash Plated. Shell: Nickel Plated.

Certifications

RoHS compliant materials, UL498 standard.

Packaging

Packaged according to customer specified requirements, typically in tray or carrier tape. Specifics per purchase order and customer drawing.

Marking

Manufacturers name, industry recognized logo, or customer approved marks.

Storage Conditions

Temperature: -25 to +85, Relative humidity: 80%, Not to store in corrosive environments. Re-qualification test required if storage exceeds 6 months.

Item	Requirements	Test Methods	Initial	After Durability	After Environmental
Contact resistance (Low Level)	80 m Max.	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.	80 m	-	-
Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).	1000 M	-	-
Dielectric Strength	500 V AC for 1 minute.	Connector must withstand test potential.	-	-	-

Electrical Characteristics	Value	Unit	Notes
Contact Current Rating	0.5	A MAX	-
Contact Resistance	100	m MAX	-
Insulation Resistance	500	M MIN	-

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