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SHETIME TFW15-N1S1-2000-A

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SHETIME TFW15-N1S1-2000-A

Brand Name : TFW15-N1S1-2000-A

Connector Type : Connector and Ejector

Model Number : TFW15-N1S1-2000-A

Stock : 100000

Card Connection Mode : Push-Push

Description : Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS

Card Type : MicroSD Card (TF Card)

MOQ : 1000

Height Above Board : 2mm

Delivery Time : 3-5工作日

Packaging Details : SMD

Card Detection : Yes

Supplementary Features : With Locating Pins

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Product Overview

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH connector, which is designed and manufactured by Dongguan Gaoyueda Electronics Co., Ltd. It is a T-Flash external welding type connector.

Brand

Dongguan Gaoyueda Electronics Co., Ltd.

Customer Part Number

TFW15-N1S1-2000-A

Product Name

T-Flash type CONN.

Origin

China

Material Compliance

RoHS

Packaging

Tape & Reel

Item	Requirements	Test Methods
1. Confirmation of Product	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
2. Contact resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
3. Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
4. Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max..	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
5. Durability (Repeated Mating/Unmating)	10 cycles	Samples are pre-conditioned with 10 cycles of durability.

Environmental Requirement	Specification	Test Method
Solderability	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.	MIL-STD-202F
Resistance to Solder Heat (Wave Soldering)	Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.	-
Resistance to Solder Heat (Infrared Reflow)	Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.	-
Cleaning (Aqueous Cleaning)	Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.	-

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