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CUI SJ2-3574A-SMT-TR

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CUI SJ2-3574A-SMT-TR

Model Number : SJ2-3574A-SMT-TR

Description : -25℃~+85℃ 12V Silver 1A Copper alloy Audio Connectors RoHS

Contact Material : Copper alloy

Brand Name : SJ2-3574A-SMT-TR

Operating Temperature : -25℃~+85℃

Delivery Time : 6-13工作日

Voltage Rating (Max) : 12V

MOQ : 1000

Contact Plating : Silver

Stock : 3304

Packaging Details : -

Current Rating : 1A

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Product Overview

The CUI Devices SJ2-357X-SMT series audio jack offers a narrow footprint and right-angle, surface-mount design, making it suitable for reflow soldering. This audio jack provides reliable connectivity for various audio applications.

Product Attributes

Brand: CUI Devices
Certifications: RoHS, UL94V-0

Technical Specifications

Parameter	Conditions/Description	Min	Typ	Max	Units
Rated Input Voltage			12		Vdc
Rated Input Current			1		A
Contact Resistance	Between terminal and mating plug			50	mΩ
Contact Resistance	Between terminal in a closed circuit		30		mΩ
Insulation Resistance	At 500 Vdc	100			MΩ
Voltage Withstand	For 1 minute		500		Vac
Insertion/Withdrawal Force		0.3		3	kg
Operating Temperature		-25		85	°C
Life	At a rate of 24 cycles/minute		5,000		cycles
Material/Plating	Terminal 1	Copper Alloy	Silver
	Terminal 2	Copper Alloy	Silver
	Terminal 3	Copper Alloy	Silver
	Terminal 4	Copper Alloy	Silver
Plastic Material		PA10T

Part Number Key

Base Number: SJ2-357X-SMT-TR

Switch Options: A* = no switch, A2* = no switch (alternate version)

Conductors: 3 = 3, 41 = 4

Package Style: SMT = surface mount

Packaging: TR = Tape & Reel

Note: 1. 4 conductor option only available with no switch (A version)

*Discontinued models SJ2-3573A2-SMT-TR & SJ2-3573A-SMT-TR

Packaging

Reel Size: Ø381 mm

Reel QTY: 1,000 pcs per reel

Solderability

Parameter	Conditions/Description	Min	Typ	Max	Units
Reel Storage	At relative humidity <80%		40		°C
Reflow Soldering	See reflow profile		255	265	°C

Drying Conditions:

Parts in reel: bake at 40°C ±5°C for 72 hours

Parts removed from reel: bake at 40°C ±5°C for 10 hours

Note: 1. Must reflow solder within 72 hours from opening vacuum packaging at a temperature <30°C & relative humidity <60%.

2. When exceeding floor life by >72 hours.

Additional Resources

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CUI SJ2-3574A-SMT-TR Images

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