| 5.1.1 Dielectric Withstanding Voltage Resistance | | EIA-364-20, 150V AC for 1 minute. Test between adjacent contacts of unmated samples. | No creeping discharge or flashes occur. Current leakage 1mA Max. |
| 5.1.2 Contact Resistance | | EIA-364-23, 100mA maximum test current and 20mV maximum open circuit voltage. | 30m Max. |
| 5.1.3 Isolation Resistance | | EIA-364-21, method C, 150V DC | 10M Min. (initial), 10M Max. (final) |
| 5.1.4 Transmission speed | | 1 pair is clock channel, 3 pairs are TMDS channel. | 3.4 GBPS per channel (Total 10.2 GBPS) |
| 5.2.1 Durability Cycling | | EIA-364-09, 10000 cycles (100 cycles per hour) | 10000 50 cycles |
| 5.2.2 Total Pulling and Insertion Force | | EIA-364-13, rate of 253mm/minute | Total Pulling Force: 4kgf Max; Total Insertion Force: 4.5kgf Max |
| 5.2.3 Terminal retention force | | Axial pull out force at the rate of 253 mm/minute on terminal assembled in housing. | 0.3kgf (3N) Min. (per pin) |
| 5.3.1 Solderability | | EIA-364-52. Dip solder tails into molten solder (2305) up to 0.5mm from tip for 30.5sec. | Solder coverage 95% Min. |
| 5.3.2 Salt Spray | | MIL-STD-1344, 51% Concentration, 35 5. Tin feet: 8 hours; Gold-plated area: 12 hours. | No physical damage. Contact Resistance: 100 milliohms Max. |
| 5.3.3 Resistance to soldering heat | | Touch terminal with soldering iron (350 10) for 3 1 seconds. No excessive pressure. | No appearance damage. |
| 5.3.4 Drop | | Free fall from 1.5m | No physical damage. |
| 5.3.5 RESISTANCE TO IR REFLOW | | 2 times of reflow | No Damage after 2 times of reflow. |
