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HanElectricity HY-8ALT

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HanElectricity HY-8ALT

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Stock : 3000

Packaging Details : SMD,P=2mm

Number of Rows : 1

Pitch : 2mm

Pins Structure : 1x8P

MOQ : 600

Description : 1x8P Tin 2mm 100V 8 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=2mm Headers, Male Pins RoHS

Contact Plating : Tin

Mounting Type : Surface Mount,Vertical

Delivery Time : 7-15工作日

Number of PINs Per Row : 8

Model Number : HY-8ALT

Z-Height of the Board : 8.1mm

Contact Material : Phosphor Bronze;PA66

Y-Width of Bottom Edge on Board : 5.1mm

Voltage Rating (Max) : 100V

Brand Name : HY-8ALT

Operating Temperature : -25℃~+85℃

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Product Overview

Scope: This specification applies to the ZH series connector strip, covering product performance, test methods, and inspection requirements.

Applicable Standards: GB/T2421, GB/T2423, GB/T2424, GB/T5095.

Use Conditions:

  • Ambient Temperature Range: -25+85
  • Applicable Wire Sizes: AWG#26#32
  • Applicable PC Board Thickness: 0.6~1.2mm

Appearance and Dimension: Product surface should be free from defects, dirt, cracks, and mechanical damage. Contacts should be free from rust, and plating should not be oxidized or peeled. Dimensions are according to drawings. Products of the same specification should be interchangeable.

Brand HANYONES ELECTRONICS CO.,LTD
Origin Dongguan
Product Name 2.0MM Connector Strip with Latch
Part No. Item Material Finish Type Requirement
N/A Terminal Phosphor bronze Tin Plating: 3~5m Contact Thickness: 0.20mm
N/A Housing Nylon66 Color: White Plastic Shell UL94V-0
N/A Housing PBT Color: White Plastic Shell UL94V-0
N/A Wafer Brass Tin Plating: 2.5~5m Contact Pin Thickness: 0.50mm
N/A Wafer PBT Color: White Plastic Shell UL94V-0
N/A Wafer Brass Tin Plating: 2.5~5m Contact Pin Thickness: 0.50mm
N/A Wafer PBT Color: White Plastic Shell UL94V-0
N/A Wafer Brass Tin Plating: 2.5~5m Contact Pin Thickness: 0.50mm
N/A Wafer PA46 Color: Beige Plastic Shell UL94V-0
N/A Wafer Brass Tin Plating: 2.5~5m Contact Pin Thickness: 0.50mm
N/A Wafer PA6T Color: Beige Plastic Shell UL94V-0
N/A Wafer Phosphor bronze Tin Plating: 3~5m Solder tab Thickness: 0.25mm
N/A Wafer PA6T Color: Beige Plastic Shell UL94V-0
N/A Wafer Brass Tin Plating: 2.5~5m Contact Pin Thickness: 0.50mm
N/A Wafer Phosphor bronze Tin Plating: 3~5m Solder tab Thickness: 0.25mm
No. Item Test Mode Requirement
6.1 Current Rated N/A 1A AC DC
6.2 Voltage Rated N/A 100V AC DC
6.3 Contact Resistance Mate connector, 20mV max voltage, 100mA max current Initial value 20m
6.4 Withstand Voltage Apply 500V AC (rms) for 1 minute between adjacent terminals and ground No breakdown or flashover, leakage current 0.5mA
6.5 Insulation Resistance Apply 500V DC (rms) for 1 minute between adjacent contacts 500 M
7.1 Terminal crimping wire strength AWG#26 wire: > 20N; AWG#28 wire: > 13N; AWG#30 wire: > 8N; AWG#32 wire: > 6N (pullout force at 253mm/min) N/A
7.2 Fixed terminals and hole seat Pull-out force at 253mm/min along wire direction Per contact: 10N
7.3 Single contact insertion force Mate connectors at 253mm/min 6N
7.4 Single contact withdrawal force Mate connectors at 253mm/min 0.6N
7.5 Pin Retention force Force on pin end at 253mm/min until needle exits seat Per contact: 10N
7.6 Durability 30 cycles (max 10 cycles/min) prior to environmental test Contact Resistance 30 m
7.7 Vibration 10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis (X, Y, Z) Appearance: No damage; Contact Resistance 30 m; Current Discontinuity: 1sec Max
8.1 Thermal Aging 852 for 96 hours Appearance: No damage; Contact Resistance 30 m
8.2 Temperature Rise Measure temperature rise at max rated current 30 Max
8.3 Humidity 402, 90-95%RH for 96 hours Appearance: No damage; Contact Resistance: 30m; Insulation Resistance: 250M; No breakdown or flashover
8.4 Temperature Cycling 5 cycles: -553 (30min) -> Room temp (10-15min) -> 853 (30min) -> Room temp (10-15min) Same as 8.3
8.5 Salt Spray 353, 51% solution. 8 hours after plating, 24 hours before plating Appearance: No damage; Contact Resistance: 30m
8.6 Solder ability Solder Temperature: 2455, Immersion: 30.5S Area of Soldering: 90%
8.7 Resistance to soldering heat Manual: 30.5S at 3505; Wave: 50.5S at 2305; Reflow: Max 20S at 2555 Appearance: No damage
No. Item SMT Lead-free Process Temperature Curve
9.1 SMT Lead-free Process Temperature Curve Refer to diagram (not provided in text)

Packaging, Transportation, Storage

Packaging: Terminals in disc loading material packaging; Plastic shells in plastic bags; Connectors in tape reels, bags, or tubes, with certificates indicating product name, specifications, quantity, and production date. Exterior packaging is cartons with packing lists.

Transportation: Any vehicle can be used, protected from moisture and mechanical damage. Transport temperature: -20~+50.


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