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TE Connectivity 2013022-1

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TE Connectivity 2013022-1

Model Number : 2013022-1

Description : Gold Surface Mount,Vertical 204P SMD Inline Module Sockets RoHS

Mounting Type : Surface Mount,Vertical

Delivery Time : 4-6 working days

Stock : 4

Contact Plating : Gold

MOQ : 22

Packaging Details : SMD

Brand Name : TE Connectivity

Number of Pins : 204P

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Product Overview

Product Name: Double Data Rate (DDR) 3 SO DIMM Sockets

Description: Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline SO DIMM Sockets with a Stack Height of 4 mm [.157 in].

Usage Conditions:

Operating Temperature Range: -55 -85 C[-67 185 F]

Application: Memory Socket Type: Memory Card, DRAM Type: Double Data Rate (DDR) 3. Suitable for Printed Circuit Board termination.

Product ID

TE Internal #: 2013022-1

Product Type

SO DIMM Sockets

Brand

Module Orientation

Right Angle

Housing Material

High Temperature Thermoplastic

Housing Color

Black

Latch Material

Stainless Steel

Ejector Type

Locking

Packaging Method

Semi-Hard Tray Assembly

Packaging Quantity

EU RoHS Compliance

Compliant

EU ELV Compliance

Compliant

China RoHS 2 Directive

No Restricted Materials Above Threshold

EU REACH Regulation

Does not contain REACH SVHC

Halogen Content

Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free

Solder Process Capability

Reflow solder capable to 260C

UL Flammability Rating

UL 94V-0

Technical Specifications

Part Number	Number of Positions	Centerline (Pitch)	Stack Height	Row-to-Row Spacing	Contact Current Rating (Max)	Contact Base Material	PCB Contact Termination Area Plating Material	Contact Mating Area Plating Material	Module Key Type	Connector System	DRAM Type
2013022-1	204	.6 mm [.024 in]	4 mm [.157 in]	8.2 mm [.322 in]	SA	Copper Alloy	Gold Flash	Gold Flash	SGRAM	Cable-to-Board	Double Data Rate (DDR) 3

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