Product Overview
FCI's Vertical DDR4 DIMM sockets offer a robust solution for memory expansion in demanding applications. Designed to JEDEC MO-309 standards, these 288-contact sockets feature a 0.85mm pitch and are ideal for servers, workstations, desktop PCs, and embedded systems in communications and industrial equipment. The low-resistance contacts support RDIMM modules, contributing to reduced power consumption in datacenter hardware. With a low 2.4mm module seating plane and slim ejector design, these sockets optimize airflow. Available in Surface-mount (SMT), Plated-Through-Hole (PTH) solder, and Press-fit (PF) termination options, they provide mechanical voltage keying and end latches for secure module retention and ejection. The low insertion-force design simplifies module installation, and contact protection supports high-speed serial differential signaling up to 3.2Gb/s.
Product Attributes
- Brand: FCI
- Contact Material: Copper alloy
- Contact Finish (Contact Area): 15in., 20in., or 30in. Gold, 30in. GXT, or Gold flash over nickel
- Contact Finish (Termination Area): Tin over nickel
- Forklock Material: Copper alloy
- Housing Material: High temperature thermoplastic, UL94V-0
- Ejector Material: High performance thermoplastic, UL94V-0
- Compliance: RoHS-Compliant and lead-free process-compatible options
- Approvals: UL and CSA approvals pending
- Packaging: Tray
Technical Specifications
| Specification | Details |
| Product Type | Vertical DDR4 DIMM Sockets |
| Number of Contacts | 288 |
| Pitch | 0.85mm |
| JEDEC Standard | MO-309 |
| Module Seating Plane Height | 2.4mm |
| Insertion Force | Less than 24 pounds force |
| Solder Tail Options | Support for 1.6mm or 2.4mm thick motherboards |
| Press-fit Termination | Supports 1.6mm min. host-PCBs |
| High-Speed Signaling | Up to 3.2Gb/s for DDR4 |
| Contact Resistance | 10m initial, 10m increase after environmental test |
| Current Rating | 0.75A/contact (De-rated) with 30C temperature rise above ambient |
| Durability | 25 cycles |
| Product Specification | GS-12-1092 |
| Packaging Specification | GS-14-2267 |
| Socket Outlines (PTH Solder) | SO-016 |
| Socket Outlines (Surface-mount) | SO-017 |
| Socket Outlines (Press-fit) | SO-019 |
| Part Reference (SMT) | 10124677 |
| Part Reference (PTH Solder) | 10124632 |
| Part Reference (Press fit) | 10124806 |
| Part Number Example | BWBDDR4MMS0613EA4 |
Target Markets/Applications
Data, Servers, Storage Systems, Supercomputers, Workstations, Desktop PCs, Communications, Switches, Routers, Wireless Infrastructure, Industrial, Embedded Systems.
